Datacon 2200 Evo Manual

DATACON 2200 evo

The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.

Eurocave manual pdf. more info on:

DATACON 2200 evo plus

The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.
Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.

ESEC 2100 xP PLUS

The Die Bonder Esec 2100 xPplus is the the 2ndgeneration of the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.

FINEPLACER® femto 2

Automated sub-micron Die Bonder

The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment.

Depending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production. It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.

Highlights

  • Sub-micron placement accuracy*
  • Handles ultra small to very large components
  • Fully-automated operation and assembly process
  • Supports wafer/substrate sizes up to 12″ *
  • Supports bonding forces up to 500 N*
  • Highly flexible platform architecture
  • Small footprint and compact design
  • Long-term stability

* depending on configuration and application

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Datacon

The Datacon 2200 EVO high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for Flip Chip applications. Equipped with integrated dispenser, 12' wafer handling, automatic tool changer and application specific tooling, the Datacon 2200 EVO is prepared for present and future processes and products.

Datacon 2200 Evo Manual Treadmill

Small footprint - 2200 evo only requires 1,4 m2 of (clean room) floor space Key specifications - Die handling from 0,17 mm - 50 mm, Placement accuracy of ±10 µm @ 3s (cmk = 1,33) Operator friendly - Despite the wide range of fittings and set-up options, operation of the 2200 evo is easy to learn - just as used for the 2200 platform. The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform. Datacon 2200 evo goes PLUS! Standard bond head 0° - 360° rotation. ÷ Heated bond head (optional). Vision Alignment.

Datacon 2200 Evo Manual Diagram

  • While significantly increasing the accuracy and placement capabilities the Datacon 2200 evoadvanceddoes not forget its roots in the Multi Module Attach family. It is still offering the unbeaten flexibility as well as the full customization capability that the Datacon 2200 evo platform is so well known for.
  • Datacon 2200 EVO. Hybrid Die Bonder. Datacon 2200 APM. Datacon 2200 apm plus. Used Datacon apm plus Multi-Chip Die Bonder for sale, refurbished.